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| 05190 EMIF6-100FC Only One Name Means ProT ek'TionTM EMI FIL TER/TVS ARRA Y APPLICA TIONS Cellular Phones Notebooks Personal Digital Assistant (PDA) Ground Positioning System (GPS) SMART Cards IEC COMPA TIBILITY (EN61000-4) 61000-4-2 (ESD): Air - 15kV, Contact - 8kV 61000-4-4 (EFT): 40A - 5/50ns FEA TURES ESD Protection > 25 kilovolts Bidirectional EMI Filtering/TVS Low Pass Filters Low Insertion Loss: -3db Roll-Off @ 60MHz Protects Up to Six(6) Data Lines MECHANICAL CHARACTERISTICS Flip Chip Package Weight 0.73 milligrams (Approximate) Flammability rating UL 94V-0 8mm Tape and Reel Per EIA Standard 481 PIN CONFIGURA TION G1 G2 G3 05190.R1 9/03 1 www.protekdevices.com EMIF6-100FC DEVICE CHARACTERISTICS MAXIMUM RATINGS @ 25C Unless Otherwise Specified PARAMETER Operating Temperature Storage Temperature DC Power Per Resistor Typical Resistance @ 20% SYMBOL TJ TSTG P R VALUE -40C to 85C -55C to 150C 100 100 UNITS C C mW OHMS ELECTRICAL CHARACTERISTICS PER LINE @ 25C Unless Otherwise Specified PART NUMBER RATED STAND-OFF VOLTAGE MINIMUM BREAKDOWN VOLTAGE MAXIMUM REVERSE LEAKAGE CURRENT @ 3V ID A 0.1 TYPICAL FORWARD VOLTAGE MINIMUM ATTENUATION CUT-OFF TYPICAL FREQUENCY CAPACITANCE (50 Ohms I/O PER LINE ZERO BIAS) (See Note 1) @2.5V, 1 MHz C pF 54 VWM VOLTS EMIF6-100FC Note 1: 20% tolerance. @ 1mA V(BR) VOLTS 6.0 @10mA VF VOLTS 0.8 @ 800-3000 MHz dB 30 fc MHz 60 5.0 1.100 FIGURE 1 RESISTANCE VS TEMPERATURE (Normalized to Resistance at 25C) Normalized Resistance 1.060 1.020 0.980 0.940 0.900 -40 -20 0 20 40 Temperature C 60 80 100 05190.R1 9/03 2 www.protekdevices.com EMIF6-100FC GRAPHS FIGURE 2 INSERTION LOSS - EMIF6-100FC 0 -5 -10 -15 Gain (dB) -20 -25 -30 -35 -40 -45 -50 0.1 1 10 100 0 Volts 2.5 Volts 1000 10000 Frequency (MHz) FIGURE 3 OVERSHOOT & CLAMPING VOLTAGE FOR EMIF6-100FC 35 5 Volts per Division 25 15 5 -5 ESD Test Pulse: +15 kilovolt, 1/30ns (waveform) FIGURE 4 OVERSHOOT & CLAMPING VOLTAGE FOR EMIF6-100FC 4 1 Volts per Division 2 0 -2 -4 ESD Test Pulse: -15 kilovolt, 1/30ns (waveform) 05190.R1 9/03 3 www.protekdevices.com EMIF6-100FC APPLICA TION INFORMA TION PRINTED CIRCUIT BOARD RECOMMENDATIONS PARAMETER Pad Size on PCB Pad Shape Pad Definition Solder Mask Opening Solder Stencil Thickness Solder Stencil Aperture Opening (laser cut, 5% tapered walls) Solder Flux Ratio Solder Paste Type Pad Protective Finish Tolerance - Edge To Corner Ball Solder Ball Side Coplanarity Maximum Dwell Time Above Liquidous (183C) Soldering Maximum Temperature 0.275mm Round Non-Solder Mask Defined Pads 0.325mm Round 0.150mm 0.330mm Round 50/50 By Volume No Clean OSP(Entek Cu Plus 106A) 50m 20m 60 Seconds 240C VALUE FIGURE 5 RECOMMENDED NON-SOLDER MASK DEFINED PAD ILLUSTRATION Non-Solder Mask Defined Pad 0.275mm DIA. Solder Mask Opening 0.325mm DIA. Solder Stencil Opening 0.330mm DIA. FIGURE 6 SOLDER REFLOW PROFILE Note: This reflow profile does not take into account the printed circuit board (PCB) material heating time. Additional time may be required for the preheat time and cool down time upon the PCB or board material. 225C 5-10 sec 200C Instantaneous to 200C 1-2 Minutes to 150C 100C 1-2 Minutes to 25C Pre-Heat Time Soldering Time Cool Down Time 05190.R1 9/03 4 www.protekdevices.com EMIF6-100FC PACKAGE OUTLINE & DIMENSIONS PACKAGE OUTLINE DIM A B C D E F G H I J PACKAGE DIMENSIONS MILLIMETERS INCHES MIN 0.1148 0.0506 0.0195 0.0096 0.0169 0.0169 0.0071 0.0071 0.017 0.013 MAX 0.1183 0.0541 0.0199 0.0100 0.0173 0.0173 0.0110 0.0110 0.022 0.018 MIN 2.915 1.285 0.495 0.245 0.430 0.430 0.180 0.180 0.432 0.330 MAX 3.005 1.375 0.505 0.255 0.440 0.440 0.280 0.280 0.559 0.457 BOTTOM VIEW A G C D E F B H SIDE VIEW O G I 1 0.30 DIA. 63/37 Sn/Pb Solder Bumps 2 3 4 5 6 I J NOTE: 1. Controlling dimensions in millimeters. T APE & REEL SPECIFICA TIONS POCKET SIZE (mm) B0 x A0 x K0 3.18 x 1.52 x 0.76 0.1 TAPE WIDTH W 8mm REEL DIAMETER 7" QTY PER REEL 3,000 PART NUMBER EMIF6-100FC CHIP SIZE (mm) 2.96 x 1.33 x 0.6 0.05 P0 4mm P1 4mm Top Cover Tape P0 10 Pitches Cumulative Tolerance On Tape 0.2mm A0 W K0 B0 For Tape Feeder Reference Only Including Draft Concentric Around B TAPE & REEL ORDERING NOMENCLATURE Embossment P1 Direction of Feed Outline & Dimensions: Rev 0 - 8/03, 06042 1. Surface mount product is taped and reeled in accordance with EIA-481. 2. Plastic 8mm Tape: Suffix-T73-1 = 7 Inch Reel - 3,000 pieces per reel, i.e., EMIF6-100FC-T73-1. COPYRIGHT (c) ProTek Devices 2003 SPECIFICATIONS: ProTek reserves the right to change the electrical and or mechanical characteristics described herein without notice (except JEDEC). DESIGN CHANGES: ProTek reserves the right to discontinue product lines without notice, and that the final judgement concerning selection and specifications is the buyer's and that in furnishing engineering and technical assistance, ProTek assumes no responsibility with respect to the selection or specifications of such products. ProTek Devices 2929 South Fair Lane, Tempe, AZ 85282 Tel: 602-431-8101 Fax: 602-431-2288 E-Mail: sales@protekdevices.com Web Site: www.protekdevices.com 05190.R1 9/03 5 www.protekdevices.com |
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